[PDF.21cp] Electrical Design of Through Silicon Via

Electrical Design of Through Silicon Via

[PDF.uv20] Electrical Design of Through Silicon Via

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 | #5506274 in Books |  2014-05-12 | Original language:English | PDF # 1 |  9.21 x.69 x6.14l,1.29 | File type: PDF | 280 pages

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||From the Back Cover||Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approach

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verificat...

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